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TRA2532 Overvoltage Transient Suppressor
24 V-32 V
Designed for applications requiring a diode with reverse avalanche characteristics for use as reverse power transient suppressor. Developed to suppress transients in automotive system, this device operates in the forward mode as standard rectifier or reverse mode as power zener diode and will protect expensive modules such as ignition, injection, antiblocking system . . . from overvoltage conditions. * High Power Capability * Economical
Mechanical Characteristics http://onsemi.com
MICRODE BUTTON CASE 193
* Finish: All External Surfaces are Corrosion Resistant, and Contact * * * *
Areas are Readily Solderable Polarity: Indicated by Cathode Band Weight: 1.8 Grams (Approximately) Maximum Temperature for Soldering Purposes: 260C Marking: 2532
MARKING DIAGRAM
2532 LYYWW
MAXIMUM RATINGS
Rating DC Blocking Voltage Average Forward Current (Single Phase, Resistive Load, TC = 150C) Peak Repetitive Reverse Surge Current (Time Constant = 10 ms, TC = 25C) Non-Repetitive Peak Surge Current (Halfwave, Single Phase, 60 Hz) Operating Junction Temperature Range Storage Temperature Range Symbol VR IO Value 23 32 Unit Volts Amps
2532 L YY WW
= Device Code = Location Code = Year = Work Week
ORDERING INFORMATION
IRSM IFSM TJ Tstg 80 500 -65 to +175 -65 to +150 Amps Amps C C Device TRA2532 Package Microde Button Shipping 5000 Units/Box
(c) Semiconductor Components Industries, LLC, 2000
1
October, 2000 - Rev. 1
Publication Order Number: TRA2532/D
TRA2532
THERMAL CHARACTERISTICS
Characteristic Thermal Resistance, Junction to Case Symbol RJC Value 0.8 Unit C/W
ELECTRICAL CHARACTERISTICS
Characteristic Instantaneous Forward Voltage (Note 1.) (iF = 100 Amps, TC = 25C) Reverse Current(1) (VR = 23 Vdc, TC = 25C) Breakdown Voltage(1) (IZ = 100 mA, TC = 25C) Breakdown Voltage (IZ = 80 Amps, TC = 25C, PW = 80 s) Breakdown Voltage Temperature Coefficient Forward Voltage Temperature Coefficient @ IF = 10 mA 1. Pulse Test: Pulse Width 300 s, Duty Cycle 2%. *Typical Symbol vF IR V(BR) V(BR) V(BR)TC VFTC Min - - 24 - 0.096* *2* Max 1.18 10 32 40 0.096* *2* Unit Volts A Volts Volts %/C mV/C
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TRA2532
IR, REVERSE CURRENT (NORMALIZED) 104 VR = 20 V 103 C t , CAPACITANCE (nF) 10 TJ = 25C
102
101
100 25 50 75 100 125 150 175 TJ, JUNCTION TEMPERATURE (C)
1 0.1 1 10 100 VR, REVERSE VOLTAGE (V)
V F , INSTANTANEOUS FORWARD VOLTAGE (mV)
Figure 1. Normalized Reverse Current
IF, AVERAGE FORWARD CURRENT (A) 1200 1150 1100 1050 1000 950 900 850 800 750 1 10 IF, AVERAGE FORWARD CURRENT (A) 100 Maximum Typical PW = 300 ms TC = 25C 80
Figure 2. Typical Reverse Capacitance
60
40
20
0 0 25 50 75 100 125 150 175 200 TC, CASE TEMPERATURE (C)
Figure 3. Forward Voltage
IRSM, PEAK REVERSE CURRENT (A) 1000 1000
Figure 4. Maximum Current Rating
TC = 25C
WRSM, PEAK REVERSE ENERGY (J)
TC = 25C 100
100
10
10 1 10 100 1000 t, TIME CONSTANT (mS)
1 1 10 100 1000 t, TIME CONSTANT (mS)
Figure 5. Maximum Peak Reverse Current
Figure 6. Maximum Reverse Energy
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TRA2532
10000 TC = 25C PRSM, PEAK REVERSE POWER (W) 2800 2600 2400 2200 2000 1800 1600 1400 1200 1000 800 600 400 200 25 50 75
PRSM, PEAK REVERSE POWER (W)
Time Constant = 10 ms
1000
Time Constant = 100 ms
100 1 10 100 1000 t, TIME CONSTANT (mS)
100
125
150
TC, CASE TEMPERATURE (C)
Figure 7. Maximum Peak Reverse Power
r(t), TRANSIENT THERMAL RESISTANCE 100 1.20 1.18 VZ (IRSM)/VZ (100 mA) 1.16 1.14 1.12 1.10 1.08 1.06 1.04 1.02 1.00 0.1 1 10 t, TIME (mS) 100 300 10 20
Figure 8. Reverse Power Derating
PW = 80 ms, TC = 25C
10-1
RqJC(t) = RqJC * r(t)
10-2
30
40
50
60
70
80
90 100 110 120
IRSM, PEAK REVERSE CURRENT (A)
Figure 9. Thermal Response
Figure 10. Typical Clamping Factor
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TRA2532
dl/dt Limitation 100 mH
2 Ohms
0 - 150 V
50 mF
TRA2532
Figure 11. Load Dump Test Circuit
100 dl/dt < 1 A/ms 80
60 (%) 40 20 0 0 0.1 t (50%) t (37%) 0.2 t (10%) t, TIME (s) 0.3 0.4 0.5 t (37%) = Time Constant t (50%) = 0.7 t (37%) t (10%) = 2.3 t (37%)
Figure 12. Load Dump Pulse Current
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TRA2532
Assembly and Soldering Information MECHANICAL STRESS
There are two basic areas of consideration for successful implementation of button rectifiers: 1. Mounting and Handling 2. Soldering Each should be carefully examined before attempting a finished assembly or mounting operation.
Mounting and Handling
COMPRESSION
TORSION
The button rectifier lends itself to a multitude of assembly arrangements, but one key consideration must always be included: One Side of the Connections to the Button Must be Flexible! This stress relief to the button should also be chosen for maximum contact area to afford the best heat transfer - but not at the expense of flexibility. For an annealed copper terminal a thickness of 0.015 is suggested.
Strain Relief Terminal for Button Rectifier Copper Terminal Button Base (Heat Sink Material)
TENSION
SHEAR
Exceeding these recommended maximums can result in electrical degradation of the device.
Soldering
The base heat sink may be of various materials whose shape and size are a function of the individual application and the heat transfer requirements.
Common Materials Advantages and Disadvantages
Steel Copper Aluminum
Low Cost: relatively low heat conductivity High Cost: high heat conductivity Medium Cost: medium heat conductivity. Relatively expensive to plate and not all platers can process aluminum.
Handling of the button during assembly must be relatively gentle to minimize sharp impact shocks and avoid nicking of the plastic. Improperly designed automatic handling equipment is the worst source of unnecessary shocks. Techniques for vacuum handling and spring loading should be investigated. The mechanical stress limits for the button diode are as follows: Compression Tension Torsion Shear 32 lbs. 32 lbs. 6-inch lbs. 55 lbs. 142.3 Newton 142.3 Newton 0.68 Newtons-meters 244.7 Newton
The button rectifier is basically a semiconductor chip bonded between two nickel-plated copper heat sinks with an encapsulating material of epoxy compound. The exposed metal areas are also tin plated to enhance solderability. In the soldering process it is important that the temperature not exceed 260C if device damage is to be avoided. Various solder alloys can be used for this operation but two types are recommended for best results: 1. 95% Sn, 5% Sb; melting point 237C 2. 96.5% tin, 3.5% silver; melting point 221C 3. 63% tin, 37% lead; melting point 183C Solder is available as preforms or paste. The paste contains both the metal and flux and can be dispensed rapidly. The solder preform requires the application of a flux to assure good wetting of the solder. The type of flux used depends upon the degree of cleaning to be accomplished and is a function of the metal involved. These fluxes range from a mild rosin to a strong acid; e.g., Nickel plating oxides are best removed by an acid base flux while an activated rosin flux may be sufficient for tin plated parts. Since the button is relatively lightweight, there is a tendency for it to float when the solder becomes liquid. To prevent bad joints and misalignment, it is suggested that a weighting or spring loaded fixture be employed. It is also important that severe thermal shock (either heating or cooling) be avoided as it may lead to damage of the die or encapsulant of the part.
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TRA2532
Button holding fixtures for use during soldering may be of various materials. Stainless steel has a longer use life while black anodized aluminum is less expensive and will limit heat reflection and enhance absorption. The assembly volume will influence the choice of materials. Fixture dimension tolerances for locating the button must allow for expansion during soldering as well as allowing for button clearance.
Heating Techniques
The following four heating methods have their advantages and disadvantages depending on volume of buttons to be soldered. 1. Belt furnaces readily handle large or small volumes and are adaptable to establishment of "on-line'' assembly since a variable belt speed sets the run rate. Individual furnace zone controls make excellent temperature control possible. 2. Flame Soldering involves the directing of natural gas flame jets at the base of a heatsink as the heatsink is indexed to various loading-heating- cooling-unloading positions. This is the most economical labor method of soldering large volumes. Flame soldering offers good temperature
control but requires sophisticated temperature monitoring systems such as infrared. 3. Ovens are good for batch soldering and are production limited. There are handling problems because of slow cooling. Response time is load dependent, being a function of the watt rating of the oven and the mass of parts. Large ovens may not give an acceptable temperature gradient. Capital cost is low compared to belt furnaces and flame soldering. 4. Hot Plates are good for soldering small quantities of prototype devices. Temperature control is fair with overshoot common because of the exposed heating surface. Solder flow and positioning can be corrected during soldering since the assembly is exposed. Investment cost is very low. Regardless of the heating method used, a soldering profile giving the time-temperature relationship of the particular method must be determined to assure proper soldering. Profiling must be performed on a scheduled basis to minimize poor soldering. The time-temperature relationship will change depending on the heating method used.
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TRA2532
PACKAGE DIMENSIONS
MICRODE BUTTON CASE 193-04 ISSUE J
A
DIM A B D F M
MILLIMETERS MIN MAX 8.43 8.69 4.19 4.45 5.54 5.64 5.94 6.25 5 _NOM
INCHES MIN MAX 0.332 0.342 0.165 0.175 0.218 0.222 0.234 0.246 5 _NOM
M D B F
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer.
PUBLICATION ORDERING INFORMATION
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TRA2532/D

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